1～2 item / All 2 items
4-layer high-density wiring circuit board
Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM
High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.
Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
