High-density component mounting such as narrow pitch CSP is possible! We will propose specifications according to your application.
Our company enables high-density component mounting such as narrow-pitch CSP.
We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures.
Please feel free to contact us when you need assistance.
【Specification Proposals】
■ Increased wiring density for inner and outer layers
→ Build-up, IVH structure
■ Measures to prevent solder blowout during the mounting of via-in-pad structures
→ Pad-on-hole structure
■ High-density CSP mounting with a pitch of 0.65mm or less
→ Build-up, pad-on-hole structure
An article about our company has been published in MONOist.
【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】
https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html
*For more details, please refer to the PDF document or feel free to contact us.